MTFDKBA256TGE-1BL1AAB

Contact Sales

Orderable parts

MTFDKBA256TGE-1BL1AABYY

Specs

Capacity

256GB
Chipset Validation

N/A
FBGA Code

N/A
Product Line

2550
Product Longevity Program

No
Product Longevity Program Start Date

N/A
READ

REACH Statement

Company statement regarding REACH SVHC compliance

File Type: (PDF)
Updated: 1/1/2024

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Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-FD-50: 2100AI/AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AI/AT PCIe NVMe SSDs.

File Type: PDF
Updated: 2021-04-23

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TN-FD-48: 5300 SSD SMART Implementation

SMART Command Feature Set for the 5300

File Type: PDF
Updated: 2020-09-17

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.

File Type: PDF
Updated: 2010-08-05

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